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CPU天梯图 2024
Intel CPU 挤牙膏进度 2008-2024
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Qualcomm Snapdragon 460 CPU天梯图 单核 性能 参数 多核 跑分 排名
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内容型号Qualcomm Snapdragon 460GeekBench6 单核跑分273GeekBench6 多核跑分995安兔兔跑分198184发布时间2020品牌Qualcomm是否有 核显带有核显GPU核显Adreno 610类型Mobile/Embedded最主频GHz1.8总核心8TDP功耗(W)3nm114gLTE Cat. 135gNowifi6bluetooth5.1videoCodecsH.264, H.265, VP8, VP9navigationGPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVICmodemX11支持主板ARMv8-ACPU介绍Qualcomm Snapdragon 460 – an 8-core chipset that was announced on January 21, 2020, and is manufactured using a 11-nanometer process technology. It has 4 cores Kryo 240 Gold at 1800 MHz and 4 cores Kryo 240 Silver at 1800 MHz.viewCount1481创建时间2023-12-10 05:37:40修改时间2025-09-28 07:27:35